Topical pharmaceutical compositions for healing wounds comprising borneol and bismuth subgallate

摘要

The present invention provides a topical pharmaceutical composition for wound healing, which comprises (a) borneol and (b) bismuth subgallate in effective amounts. The topical pharmaceutical composition is capable of enhancing wound healing with minor irritations to injured skin, and preventing formation of scars or granulation tissues so as to help regenerate the skin with normal tenderness and appearances.