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An electromagnetic interference cover for a conduit and an electronic equipment chassis employing the same

机译:用于导管的电磁干扰罩和使用该电磁干扰罩的电子设备机箱

摘要

For use with an electronic equipment chassis having a module support member adapted to receive an electronic module and having a conduit containing an electrical conductor proximate the module support member, an electromagnetic interference (EMI) cover, method of manufacturing the EMI cover (100) and electronic equipment chassis employing the same. In one embodiment, the EMI cover includes a conductive body (105) that substantially conforms to the conduit (20) and a boss (110) extending from the conductive body and configured to contact a conductive case of the electronic module (25). The boss (110) provides a conductive path between the conduit (20) and the electronic module (25) to establish a common voltage potential therebetween thereby reducing EMI emissions associated with the electronic module.
机译:用于具有模块支撑构件的电子设备机箱,该模块支撑构件适于容纳电子模块,并且具有包含在模块支撑构件附近的电导体的导管,电磁干扰(EMI)盖,制造EMI盖(100)的方法和电子设备底盘也采用相同的方法。在一个实施例中,EMI盖包括基本上符合导管(20)的导电体(105)和从该导电体延伸并构造成接触电子模块(25)的导电壳体的凸台(110)。凸台(110)在导管(20)和电子模块(25)之间提供导电路径,以在它们之间建立公共电压电位,从而减少与电子模块相关的EMI辐射。

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