ELECTROPLATING SOLUTION, METHOD FOR FABRICATING MULTILAYER PRINTED WIRING BOARD USING THE SOLUTION, AND MULTILAYER PRINTED WIRING BOARD

摘要

The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener.