IC A SUSPENSION SUPPORTING A HEAD SLIDER AND HAVING A HEAD IC CHIP WITHOUT INCREASING AN EQUIVALENT MASS OF THE SUSPENSION A HEAD SLIDER SUPPORTING DEVICE USING THE SUSPENSION AND A DISC APPARATUS USING THE HEAD SLIDER SUPPORTING APPARATUS

摘要

The wiring pattern with small inductance and small capacitance can be formed without increasing the equivalent mass of the suspension supporting the head slider in the disk device. The suspension elastically supports the head slider with the head. The base portion of the suspension is mounted to an arm driven by an actuator. The head slider is mounted on a head slider mount formed on the end of the suspension opposite the base portion. The tongue section is formed along the side of the base portion. The tongue piece projects vertically from the base part. The head IC chip is mounted on the head IC chip mounting portion formed at the tongue section.