ELECTRONIC DEVICE SEALING ELECTRONIC ELEMENT THEREIN AND MANUFACTURING METHOD THEREOF AND PRINTED WIRING BOARD SUITABLE FOR SUCH ELECTRONIC DEVICE

摘要

PURPOSE: Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic elememt are provided to achieve mass production of cheap and small-sized electronic devices, as well as, superior in hermetical sealing property of the case formed, so as to protect the built-in electronic device from being deteriorated in the characteristics thereof. CONSTITUTION: An electronic device comprises a substrate of insulating resin having at least a pair of interior terminal portions for connection upon an upper surface thereof, an electronic element mounted on the terminal portions on the upper surface of the substrate, having at least a pair of electrode terminals thereof, a frame member of insulating resin, bonded on the upper surface of the substrate, and having a cavity formed for storing the electronic element therein, and a cover member of insulating material, for hermetically sealing over the cavity of the frame member, in which the electronic element is stored, wherein electrodes are formed at or in vicinity of positions of the terminals of the electronic element stored within the cavity, for electrically conducting the interior terminal portions for connection to an outside.