首页> 外国专利> Dielectric material using reactive dendrimer and starburst compound and process for manufacturing thin film formed of the same

Dielectric material using reactive dendrimer and starburst compound and process for manufacturing thin film formed of the same

机译:使用反应性树状大分子和星爆化合物的介电材料及其制造薄膜的方法

摘要

PURPOSE: A dielectric material and a method for forming a thin layer using reactive dendrimer and starburst compound are provided to provide low-dielectric material and a low permittivity and excellent properties required to a semiconductor manufacturing process and the durability of semiconductors. CONSTITUTION: The dielectric material comprises dendrimer or starburst, which end has organosilane as follow: (R1O)m(R2)nSiR3 here, m+n=3, m=1, 2 or 3, R1 and R2 are independent C1-C10 aliphatic alkyl groups, R3 is alkyl group of 1-10 carbon number having vinyl, halogen, alkoxy, nitro, nitrile, amine, acryloxy or epoxy groups substituent in its end. The dendrimer is poly(amidoamine) or polypropylene dendrimer. The starburst is poly(-carprolactone) starburst.
机译:目的:提供一种介电材料和使用反应性树状聚合物和星状化合物形成薄层的方法,以提供低介电材料和低介电常数以及半导体制造工艺和半导体耐久性所需的优异性能。组成:介电材料包括树枝状或星状,其末端具有如下有机硅烷:(R1O)m(R2)nSiR3在这里,m + n = 3,m = 1、2或3,R1和R2是独立的C1-C10脂族烷基,R 3是碳数为1-10的烷基,其末端具有乙烯基,卤素,烷氧基,硝基,腈,胺,丙烯酰氧基或环氧基取代基。树枝状聚合物是聚(酰胺基胺)或聚丙烯树枝状聚合物。爆炸形是聚(-己内酯)爆炸形。

著录项

  • 公开/公告号KR20020020503A

    专利类型

  • 公开/公告日2002-03-15

    原文格式PDF

  • 申请/专利权人 POSTECH FOUNDATION;

    申请/专利号KR20000053707

  • 发明设计人 LEE MUN HO;OH WON TAE;

    申请日2000-09-09

  • 分类号H01B3/46;

  • 国家 KR

  • 入库时间 2022-08-22 00:31:24

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