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Dielectric material using reactive dendrimer and starburst compound and process for manufacturing thin film formed of the same

机译:使用反应性树状大分子和星爆化合物的介电材料及其制造薄膜的方法

摘要

The present invention is a low dielectric material and as it relates to a process for the preparation, to the low-k materials, including dendritic (dendrimer), or a starburst (starburst) having the silane compound (organosilane) a terminal having an organic substituent of the formula (1), the low method for synthesis of genetic material, and provides a process for the preparation of ultra-low dielectric films using the low dielectric material:; Formula 1; (R 1 O) m (R 2) n SiR 3.; Wherein R is a m + n = 3 and m is 1, 2 or 3, R 1 and R 2 are independently C 1 -C 10 aliphatic alkyl group of one another, R 3 is vinyl, halogen, alkoxy, nitro, nitrile, is a hydrocarbon group having an amine, acryloxy or epoxy group as a terminal substituent.
机译:本发明是一种低介电材料,并且涉及其制备方法,该低k材料包括树枝状(树状聚合物)或具有硅烷化合物(有机硅烷)的星形爆炸(星形爆炸),所述硅烷化合物(有机硅烷)的末端具有有机基团。式(1)的取代基,遗传材料的低合成方法,并提供了使用该低介电材料制备超低介电薄膜的方法:公式1; (R 1 O)m(R 2)n SiR 3 .;其中R为am + n = 3,m为1、2或3,R 1 和R 2 独立地为C 1 -C <彼此的Sub> 10 脂族烷基,R 3 是乙烯基,卤素,烷氧基,硝基,腈,是具有胺,丙烯酰氧基或环氧基作为末端取代基的烃基。

著录项

  • 公开/公告号KR100491965B1

    专利类型

  • 公开/公告日2005-05-27

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20000053707

  • 发明设计人 이문호;오원태;

    申请日2000-09-09

  • 分类号H01B3/46;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:50

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