Working Pressure Distribution Measuring Apparatus Pressure Measuring Seat and Manufacturing Method Thereof Method of Measuring Working Pressure Distribution and Method of Measuring Thermal Distribution

摘要

PURPOSE: A CMP process pressure distribution measuring apparatus, a pressure-measuring sheet and its method of manufacture,a CMP process pressure distribution measuring method, and a temperature distribution measuring method are provided to measure CMP process pressure distribution accurately and in a state which is close to actual polishing. CONSTITUTION: CMP process pressure distribution, applied to a semiconductor substrate(3), is measured by using a pressure measuring sheet(5) having an upper electrode(51) which is in contact with the semiconductor substrate(3), lower electrodes(53) which are in contact with a polishing pad(1) and piezoelectric material(52), which is placed between the upper electrode(51) and the lower electrodes(53).