Synthesis of Low Viscosity Imide Oligomers for the Packaging of Microelectronic Devices

摘要

PURPOSE: Provided is a method for preparing a low viscosity and high capability imide oligomer having an excellent property as under-filler insulating material for thin film in microelectronic device or thin film package. CONSTITUTION: The method comprises introducing a crosslinking terminal group into imide oligomer to synthesize a thermosetting polyimide. A thermosetting polyimide obtained by the method has an excellent property as under-filler for the production of microelectronic device. The polyimide has an excellent solubility in NMP, THF, DMSO, DMAc, and etc., which are organic solvents and can be used in thin film package and electronic device. Also, the polyimide has excellent electric, chemical and mechanical properties.