Base resin for conductive paste and conductive paste comprising the base resin

摘要

PURPOSE: Provided are a base resin for a conductive paste, which has low salt-concentration, high heat-stability, proper curing-velocity, and high water-resistance, and a conductive paste containing the base resin. CONSTITUTION: The base resin comprises 10-30pts.wt. of epoxy-vinyl monomers such as a diallylphthalate monoepoxy derivative(formula 1), 10-20pts.wt. of vinyl monomers such as methylmethacrylate, 5-20pts.wt. of a curing agent such as an imidazole derivative, 0.1-5pts.wt. of a curing accelerator, 0.01-0.1pts.wt. of a radical initiator, and the balance being an epoxy resin such as a bisphenol A epoxy resin. And the conductive paste contains the base resin. In the formula, R1-R4 are C1-C20 alkyl, branched alkyl, alkenyl, branched alkenyl, cycloalkyl, cycloalkenyl, hydroxy alkyl, and etc.