Tape type lead-frame strip and structure and manufacturing method of lead exposed semiconductor chip package using it

摘要

PURPOSE: A tape-type lead frame strip and an exposed load package and a manufacturing method using the same are provided to form a thin ELP(Exposed Lead Package) and to improve a reliability, a burr and a warpage by using a tape having a thin pattern lead and adhesive part instead of Ag epoxy. CONSTITUTION: A tape-type lead frame strip comprises a tape(240) having a number of semiconductor chip locating regions(223b) and pattern lead formation regions(223a) on one side of the tape(240), adhesive layers(246) formed on the semiconductor chip locating regions(223b) and pattern lead formation regions(223a) instead of Ag epoxy, thereby improving a reliability, and a plurality of thin pattern leads(244) stick to the adhesive layers(246) on the semiconductor chip locating regions(223b), thereby reducing an occurrence of a burr. At this point, the semiconductor chip locating regions(223b) are aligned with a lattice array and the pattern leads(244) are formed between the semiconductor chip locating regions(223b) and at the edge portions.