Method of Confirming Progress in Semi-conductor Assembly Process using Moisture Color Changing Compound

摘要

PURPOSE: A method of confirming progress in semiconductor assembly process using moisture color changing compound is provided to ascertain whether a die attach curing process, a plasma cleaning process or a post curing process are passed or not, and an indicating mark using the wetness indicator is provided for a PCB, a magazine and a tray. CONSTITUTION: The wetness indicator(11) uses a moisture color changing compound such as cobalt chloride contained in a transparent or translucent element such as silica gel. The color change compound becomes altered in color according to relative moisture. The indicating mark of a base material(12) such as the PCB, the magazine and the tray includes a plurality of grooves, which are filled with the wetness indicator(11) and have different depths. Since the wetness indicator(11) alters in color from a surface adjoining the air, the degree of color change informs progressing time of heat treatment or plasma treatment.