HEATING AND COOLING SYSTEM FOR FLOOR, CEILING, AND WALLS, ITS MANUFACTURING PROCESS, AND MODULAR ELEMENT

摘要

FIELD: heating and cooling systems. SUBSTANCE: system has panels with grooves on their surfaces; heat-conducting sheet is attached to panel surface to form heat- transfer surface; panels are joined together to constitute rough floor whereon surfaces of interconnected panels form long track of grooves for inserting heat energy transfer means disposed in material being hardened to form flat heat-conducting surface for rough floor pending construction of walls and partitions. System manufacturing process includes arrangement of plurality of panels to form rough floor wherein modular geometry of grooves of plurality of panels constitutes net of grooves over entire surface of rough floor; disposition of material being hardened in heat energy transfer medium; leveling of material being hardened to form flat surface with heat-transfer surface of panel; treatment of composition being hardened to form filled-up heat-conducting surface on rough floor of storey irrespective of disposition of walls and partitions. Modular element has panel with groove crossing at least one edge of panel, heat-conducting sheet arranged on panel surface that follows shape of the latter and forms heat-conducting surface, groove with heat-conducting coating, and hardening material that forms flat surface with heat- conducting surface. EFFECT: reduced cost of materials and weight; reduced heat-up period, enhanced reliability of system. 12 cl, 11 dwg