METHOD FOR OBTAINING INTERMEDIATE PRODUCT FOR MOLDED WAFERS, INTERMEDIATE PRODUCT FOR MOLDED WAFERS, MOLDED WAFER BASED ON INTERMEDIATE PRODUCT AND MOLD FOR PRODUCING MOLDED WAFERS

摘要

FIELD: food-processing industry. SUBSTANCE: method involves molding cup-shaped wafers C from intermediate product, wherein molded parts are connected with flat parts of their bases A. Molded parts C have thickness of, for example, 1-1.5 mm as compared to much greater thickness (in the order of 2.2-2.5 mm) of base part A. It allows intermediate product P to be withdrawn from mold without damage, even when molded parts C have much thinner walls. EFFECT: increased efficiency and improved quality of product. 10 cl, 3 dwg