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Faraday cage for integrated circuit has lower and upper metallization planes filled with metallization layers and connected at edges by metal ring structures in intermediate planes

机译:集成电路的法拉第笼具有上下金属化平面,该金属化平面填充有金属化层,并且在边缘处通过金属环结构在中间平面中连接

摘要

The Faraday cage has an upper and a lower metallization plane (M5, M1) substantially filled with an upper and a lower metallization layer (18,19) and the upper and lower metallization layers are connected at their edges by metal ring structures (20-22) in metallization planes (M2-M4) between the upper and lower metallization planes..
机译:法拉第笼的上,下金属化平面(M5,M1)基本上充满了上,下金属化层(18,19),上,下金属化层的边缘通过金属环结构(20- 22)在上下金属化平面之间的金属化平面(M2-M4)中。

著录项

  • 公开/公告号DE10026933C1

    专利类型

  • 公开/公告日2001-12-06

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2000126933

  • 发明设计人 BREILMANN JOCHEN;

    申请日2000-05-30

  • 分类号H01L23/66;H05K9/00;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:43

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