Production of integrated circuit comprises applying metallization layers to circuit substrate, and forming hard mask at predetermined temperature which effects phase conversion

摘要

The production of an integrated circuit comprises preparing a circuit substrate (1); applying metallization layers (5, 10) to the substrate; forming a hard mask (20) on the metallization layers; and structuring the metallization layers using the mask. The mask is applied at a predetermined temperature which effects a phase conversion in the metallization layers. Preferred Features: The first metallization layer (5) is a liner layer and the second metallization layer is an aluminum layer. The predetermined temperature is approximately 400 deg C or more. The hard mask is produced by CVD deposition of a SiO2-based material.