Optoelectronic component used as an SMD-LED comprises a multilayered base plate, a semiconductor chip with electrical connections and a plastic for encapsulating the base plate and chip

摘要

Optoelectronic component comprises a multilayered base plate (10), a semiconductor chip (15) with electrical connections and a plastic for encapsulating the base plate and chip. The chip is contacted with and integrated on the base plate. A boundary surface (18) with delayed creep behavior is formed on the outer shell. Preferred Features: The boundary surface consists of two similar or identical materials having good adhesion. The multilayered system consists of an electrically conducting layer (12) and an insulating layer (19).