首页> 外国专利> Differential pressure sensor produced using bulk micro-machining using CMOS or bipolar production technology so that an analysis circuit is readily integrated with it, reducing production costs

Differential pressure sensor produced using bulk micro-machining using CMOS or bipolar production technology so that an analysis circuit is readily integrated with it, reducing production costs

机译:使用CMOS或双极生产技术通过批量微加工生产的压差传感器,因此可以轻松集成分析电路,从而降低了生产成本

摘要

Micro-machined differential pressure sensor comprises a substrate (1) with a hollow space (3) on one side of a main surface (2). The space is delimited by a movable membrane (4), a doped silicon wall (6) and an isolating layer (5). An opening (12), which is connected to a medium at a second pressure, connects to a channel (13) linking it to the hollow space. The hollow space, movable membrane and doped wall form a capacitor that is used to measure differential pressure. An analysis circuit is formed on the main surface of the pressure sensor.
机译:微机械压差传感器包括衬底(1),该衬底在主表面(2)的一侧上具有中空空间(3)。该空间由可移动膜(4),掺杂的硅壁(6)和隔离层(5)界定。在第二压力下连接至介质的开口(12)连接至将其连接至中空空间的通道(13)。空心空间,可移动膜和掺杂壁形成电容器,用于测量压差。分析电路形成在压力传感器的主表面上。

著录项

  • 公开/公告号DE10062637A1

    专利类型

  • 公开/公告日2002-07-04

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2000162637

  • 发明设计人 KOLB STEFAN;WERNER WOLFGANG;

    申请日2000-12-15

  • 分类号G01L13/02;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:15

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