Power semiconductor module has capacitor and power semiconductor device disposed directly on heat sink having cooling medium channels

摘要

The module includes a heat sink (2B) on which a first power semiconductor device (1A,1B) is directly disposed. A capacitor (20) is directly disposed on the heat sink. The power semiconductor device and the capacitor may be arranged on different surfaces of the heat sink. The heat sink may include a channel (2BH) for a cooling medium.