Heat sink for cooling e.g. power semiconductor of current converter, has contact surface delivering heat energy to cooling device, and heat conductive channel conducting heat to cooling device, contact surface and another cooling device

摘要

The heat sink (1) has a contact surface (9) provided for delivering the heat energy to a cooling device (15). A heat conductive channel (13) is provided for conducting heat to the cooling devices (5, 15) and the contact surface, where a cross-section of the heat conductive channel correlates with the heat emission that is to be conducted. The heat conductive channel exhibits a position that is oriented to a center of the contact surface. The contact surface forms a portion of an outer side of a current converter. An independent claim is also included for a current converter comprising a fan.