首页> 外国专利> Contactless transponder for contactless chip card has chip in module arranged in opening in base film into which conductors are lowered

Contactless transponder for contactless chip card has chip in module arranged in opening in base film into which conductors are lowered

机译:用于非接触式芯片卡的非接触式应答器具有模块中的芯片,该模块布置在基膜的开口中,降低了导体的位置

摘要

At least one chip and an electrical conductor arrangement are arranged on a thermoplastic base film (4). An opening is made in the base film, and a module arranged in it. The chip is contained inside the module. The electrical conductor arrangement extends in multiple planes. The lower conductors of the conductor arrangement are lowered into base film.
机译:在热塑性基膜(4)上布置至少一个芯片和电导体装置。在基膜中形成一个开口,并在其中设置一个模块。芯片包含在模块内部。电导体装置在多个平面中延伸。导体装置的下部导体降低到基膜中。

著录项

  • 公开/公告号DE10109030A1

    专利类型

  • 公开/公告日2002-09-12

    原文格式PDF

  • 申请/专利权人 CUBIT ELECTRONICS GMBH;

    申请/专利号DE2001109030

  • 发明设计人 MICHALK MANFRED;

    申请日2001-02-24

  • 分类号G06K19/077;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:07

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