Ceramic-metal substrate has profiling in metal layer for reducing thermodynamic stresses provided in vicinity of electrical components or contact elements

摘要

The substrate has profiling (P) in a metal layer for reducing thermodynamic stresses. The profiling is provided in the vicinity of electrical components or contact elements. At least one further metal profile is applied to a metal layer of the substrate in the form of a cascade. A bearer plate is applied to at least one exposed profile.