Integrated circuit has high frequency signal connections arranged at center of package to minimize path lengths

摘要

Connection pins (6,7) for connection to high frequency signal lines are attached to the center of the package to minimize the path lengths of the corresponding wiring lines. The pins may be attached to the package in a matrix formation. The line inductances of the wiring lines for high frequency signal connections are minimal. Contact pads are arranged along a line of symmetry (S) of the package. Data connection pins and corresponding ground pins are arranged in groups along the line of symmetry. An Independent claim is also included for a package for an integrated circuit.