首页> 外国专利> Process, for controlling a laser processing device, comprises placing the sensor electrode on the laser processing head, measuring a minimal measuring capacity, comparing with an actual capacity, and processing a command signal

Process, for controlling a laser processing device, comprises placing the sensor electrode on the laser processing head, measuring a minimal measuring capacity, comparing with an actual capacity, and processing a command signal

机译:用于控制激光处理设备的方法包括:将传感器电极放置在激光处理头上;测量最小测量容量;与实际容量进行比较;以及处理命令信号

摘要

Process involves placing sensor electrode (8) on laser processing head (1); positioning head relative to workpiece at distance corresponding to desired minimal measuring capacity (Cmin); measuring minimal measuring capacity and storing value in electronic storage device; comparing with actual capacity measured during processing of workpiece (7); and processing command signal when actual capacity is less than stored minimal capacity. An Independent claim is also included for a laser processing device for carrying out the process.
机译:处理过程包括将传感器电极(8)放在激光处理头(1)上;将测头相对于工件定位在与所需最小测量能力(Cmin)相对应的距离处;在电子存储设备中测量最小的测量容量和存储值;与工件加工过程中测得的实际容量进行比较(7);当实际容量小于存储的最小容量时,处理命令信号。还包括用于执行该过程的激光处理设备的独立权利要求。

著录项

  • 公开/公告号DE10121655C1

    专利类型

  • 公开/公告日2002-10-31

    原文格式PDF

  • 申请/专利权人 PRECITEC KG;

    申请/专利号DE2001121655

  • 发明设计人 SPOERL GEORG;

    申请日2001-05-03

  • 分类号B23K26/42;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:00

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