Semiconductor component, used in MOSFET, comprises semiconductor body, electrically and thermally conducting housing base surface, insulating layer, conducting connecting layer, casing, and connecting pins

摘要

A semiconductor component comprises a semiconductor body (10); an electrically and thermally conducting housing base surface; a thermally conducting and electrically insulating layer (40) applied to the housing base surface; an electrically and thermally conducting connecting layer (50) arranged on the insulating layer; a casing (20) surrounding the semiconductor body; and connecting pins protruding from the casing. Preferred Features: The insulating layer is made from a metal oxide, thermally conducting adhesive or thermally conducting film. The semiconductor body is adhered or soldered to the connecting layer. The connecting layer consists of a metallic plate.