Circuit board has openings in bearer layer with larger diameter than openings in metal layer; at least parts of metal layer protruding into vicinity of opening in bearer layer are structured

摘要

The circuit board has an electrically isolating bearer layer (2) and at least one relatively thick metal layer (3) with openings (5,6,7) in both layers for accommodating plug contacts of electrical/electronic components. An opening in the bearer layer has a larger diameter than an opening in the metal layer and at least parts of the metal layer protruding into the vicinity of an opening in the bearer layer are structured. AN Independent claim is also included for the following: a unit with an inventive device and at least one electrical component with plug contacts.