首页> 外国专利> Surface wave element for fitting in communications devices has a metallized electrode positioned above signal electrodes without contact with them or with an insulating joining material

Surface wave element for fitting in communications devices has a metallized electrode positioned above signal electrodes without contact with them or with an insulating joining material

机译:用于安装在通信设备中的表面波元件具有金属化的电极,该金属化的电极位于信号电极上方,而不与它们接触或与绝缘连接材料接触

摘要

A metallized electrode is in a fixed position on the main body of a casing (3) so that the metallized electrode is positioned above signal electrodes (6) but does not come in contact with the signal electrodes nor with an insulating joining material. The metallized electrode is capable of carrying conduction to an earthing electrode (5). The main body has a substrate (10) and framework bodies (4).
机译:金属化电极位于壳体(3)的主体上的固定位置,使得金属化电极位于信号电极(6)上方,但不与信号电极或绝缘连接材料接触。金属化的电极能够将导电传递到接地电极(5)。主体具有基板(10)和框架主体(4)。

著录项

  • 公开/公告号DE10139166A1

    专利类型

  • 公开/公告日2002-02-28

    原文格式PDF

  • 申请/专利权人 MURATA MFG. CO. LTD.;

    申请/专利号DE2001139166

  • 发明设计人 IRIE YUJI;

    申请日2001-08-09

  • 分类号H03H9/25;H03H9/145;

  • 国家 DE

  • 入库时间 2022-08-22 00:26:52

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