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Surface wave element for fitting in communications devices has a metallized electrode positioned above signal electrodes without contact with them or with an insulating joining material
Surface wave element for fitting in communications devices has a metallized electrode positioned above signal electrodes without contact with them or with an insulating joining material
A metallized electrode is in a fixed position on the main body of a casing (3) so that the metallized electrode is positioned above signal electrodes (6) but does not come in contact with the signal electrodes nor with an insulating joining material. The metallized electrode is capable of carrying conduction to an earthing electrode (5). The main body has a substrate (10) and framework bodies (4).
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