首页> 外国专利> Chemical/mechanical polishing slurry, used in producing shallow trench insulation in silicon wafer with oxide and nitride coatings, comprises abrasive particles in aqueous solution containing two different passivating agents

Chemical/mechanical polishing slurry, used in producing shallow trench insulation in silicon wafer with oxide and nitride coatings, comprises abrasive particles in aqueous solution containing two different passivating agents

机译:化学/机械抛光浆料,用于在带有氧化物和氮化物涂层的硅片中产生浅沟槽绝缘,在水​​溶液中包含含有两种不同钝化剂的磨料颗粒

摘要

Chemical/mechanical polishing slurry comprises an aqueous solution containing abrasive particles and 2 different passivating agents.
机译:化学/机械抛光浆料包含含有磨料颗粒和2种不同钝化剂的水溶液。

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