The production process begins with application of electrically conductive tracks (15-20). They are applied by moulded interconnection device technology to the floor (7) and sloping walls (6) of the recess (5). The tracks are connected on the same side of the card (1) to external contact pads (2), and are interdigitated on the floor of the recess. The chip (4) is secured to the floor with a nonconductive adhesive applied between its contactless face and the underlying tracks. Connections are made by soldering the conductive wires (12) between the chip contacts and the ends of the tracks. The recess is then filled with protective resin which is finally polymerised.
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