The spatter cleaning chamber and the wafer base assembly and semiconductor metal conversion production manner and improves the void restoration capacity of aluminum the manner

摘要

PROBLEM TO BE SOLVED: To provide a sputter cleaning chamber wafer table which can improve the capability of filling voids in an aluminum metal wiring by avoiding the temperature rise of a wafer, and to provide a semiconductor metallization method using the wafer table.;SOLUTION: A cooling pipe 22 is provided in a wafer table in a sputter clean chamber which cleans a wafer to subject the wafer in the cleaning process to a cooling treatment. Then a wafer is placed in a physical vapor phase deposition chamber, a titanium metal layer is formed, and an aluminum layer is formed on the titanium metal layer. Since the temperature rise can be avoided, the void-filling capability of the aluminum layer can be improved.;COPYRIGHT: (C)2002,JPO