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Implemental state inspection manner and implemental state survey instrument null

机译:实施状态检查方式和实施状态调查手段null

摘要

PROBLEM TO BE SOLVED: To provide a mounting state inspecting method for electronic part in which the mounting state can be inspected even for an electronic part having an upper surface where diffuse reflection does not take place easily. ;SOLUTION: A measuring point set at the position of an electronic part on the upper surface of a board 2 mounting an electronic part 3 is irradiated, from above, with laser light generated from a laser generator 4 and the diffuse reflection light from the measuring point is received by a photodetector 6 in order to inspect the mounting state of the electronic part 3. In such a method for inspecting the mounting state of an electronic part, a decision is made an electronic part 3 having a structure where diffuse reflection does not take place easily, e.g. a glass coat part 3a, is mounted if diffuse reflection light of a given intensity or above is not received and an effective current required for measuring the height is not detected at a current detecting section 11.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:提供一种电子部件的安装状态检查方法,其中即使对于具有不容易发生漫反射的上表面的电子部件,也可以检查安装状态。 ;解决方案:从上方用激光发生器4产生的激光和测量产生的漫反射光照射设置在安装电子部件3的板2的上表面上电子部件位置的测量点。为了检测电子零件3的安装状态,由光电检测器6接收该点。在这种检查电子零件的安装状态的方法中,确定具有不具有漫反射的结构的电子零件3。容易发生,例如如果没有接收到给定强度或更高强度的漫反射光并且在电流检测部分11上未检测到测量高度所需的有效电流,则安装玻璃涂层部件3a 。;版权所有:(C)1999,JPO

著录项

  • 公开/公告号JP3419287B2

    专利类型

  • 公开/公告日2003-06-23

    原文格式PDF

  • 申请/专利权人 松下電器産業株式会社;

    申请/专利号JP19970352624

  • 发明设计人 塚本 満早;

    申请日1997-12-22

  • 分类号G01B11/00;H05K13/08;

  • 国家 JP

  • 入库时间 2022-08-22 00:21:19

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