首页> 外国专利> The both sides implemental substrate which includes the part where the part is implemented by record media and the survey instrument null both sides of bump record the program and that program of manner, inspection manner and those manners which of the bump

The both sides implemental substrate which includes the part where the part is implemented by record media and the survey instrument null both sides of bump record the program and that program of manner, inspection manner and those manners which of the bump

机译:包括通过记录介质和测量仪器来实现该部分的部分的两侧工具基板,颠簸的两侧记录该程序以及那种程序,方式,检查方式以及颠簸的那些方式

摘要

PPROBLEM TO BE SOLVED: To recognize accurately a bump area as a preceding step of image processing by a subtraction method. PSOLUTION: A both-surface mounting substrate which is an inspection object is measured, and its radiographic image is taken, and a bump simple body image is extracted. Relative position information of the bump simple body image is acquired, and a bump position overlapped with another image is estimated from regularity of bump arrangement. The estimated bump position is corrected by utilizing, for example, Hough transform. The bump area is determined by, for example, matching with a circular pattern having the equal size as the bump on the corrected bump estimated position. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:作为减法方法,在图像处理的先前步骤中准确识别凹凸区域。

解决方案:测量作为检查对象的两面安装基板,并拍摄其放射线图像,并提取凸块简单体图像。获取凸块简单体图像的相对位置信息,并且根据凸块布置的规律性来估计与另一图像重叠的凸块位置。通过利用例如霍夫变换来校正估计的凸起位置。例如,通过与具有与校正后的凸起估计位置上的凸起相同大小的圆形图案匹配来确定凸起区域。

版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4380371B2

    专利类型

  • 公开/公告日2009-12-09

    原文格式PDF

  • 申请/专利权人 株式会社島津製作所;

    申请/专利号JP20040068639

  • 发明设计人 矢作 栄司;

    申请日2004-03-11

  • 分类号G01N23/04;G06T1/00;G06T7/60;H01L21/60;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 18:56:53

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