Epoxy resin constituent for copper-clad laminate, copper-clad laminate and multilayer laminate

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition affording copper foils or copper inner layer circuits with high bond strength to the epoxy resin. ;SOLUTION: This epoxy resin composition comprises a bisphenol A-type epoxy resin with an average epoxy equivalent of 2,500-10,000, another poly(≥2) functional epoxy resin, a hardener and a hardening accelerator; wherein the former epoxy resin accounts for 10-30 wt.% of the total epoxy resin. Incorporation of the former epoxy resin affords the above-mentioned advantage in the 2nd objective copper-clad laminates using this composition.;COPYRIGHT: (C)2000,JPO