首页> 外国专利> POLISHING SHEET HAVING RECESSED PART IN POLISHING LAYER

POLISHING SHEET HAVING RECESSED PART IN POLISHING LAYER

机译:抛光板在抛光层中占重要部分

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive and resource saving polishing sheet superior in polishing performance applying finish polishing to a surface or an end face of a precision component such as a magnetic head, magnetic and optical discs, a semiconductor wafer, flattening of a semiconductor integrated circuit, an optical lens or an optical fiber by a polishing layer of a minimum area.;SOLUTION: In the polishing sheet, a polishing layer with an optional pattern necessary in polishing work is formed in one face of a substrate film. It is characterized by that partial recessed parts are formed on the polishing layer, the recessed parts are concentric, a polka-dot pattern, radial, volute, hexagonal or diagonal, a bank layer or a water repellent layer is provided on an outer circumferential part and/or an inner circumferential part not formed with the polishing layer, and pressure sensitive adhesive layers are provided in bottom faces of the polishing layer recessed parts.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种廉价且节省资源的抛光片,其抛光性能优异,可对诸如磁头,磁盘和光盘,半导体晶片等精密部件的表面或端面进行精抛光,从而使抛光片平整。半导体集成电路,光学透镜或光纤通过最小面积的抛光层实现;解决方案:在抛光片中,具有抛光工作所需的可选图案的抛光层形成在基底膜的一个面上。其特征在于,在研磨层上形成有局部凹部,该凹部是同心的,在外周部设置有圆点图案,放射状,蜗壳状,六边形或对角线状,堤层或疏水层。和/或未形成有研磨层的内周部,在研磨层凹部的底面设置有粘合剂层。版权所有:(C)2003,日本特许厅

著录项

  • 公开/公告号JP2003103470A

    专利类型

  • 公开/公告日2003-04-08

    原文格式PDF

  • 申请/专利权人 DAINIPPON PRINTING CO LTD;

    申请/专利号JP20010299296

  • 发明设计人 HORI YAICHIRO;

    申请日2001-09-28

  • 分类号B24D11/00;B24B37/00;B24D7/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:19:39

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