PROBLEM TO BE SOLVED: To provide a silica-based film forming composition and the like, which can form a silica-based film excellent in mechanical strength such as sufficient CMP (chemical mechanical polish) resistance, low dielectric properties, and adhesive properties.;SOLUTION: The silica-based film forming composition comprises (a) a siloxane resin of an alkoxysilane and the like as a constituent, (b) a solvent such as an alcohol that can dissolve the siloxane resin as a constituent, and (c) an onium salt such as an ammonium salt as a constituent.;COPYRIGHT: (C)2003,JPO
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