FLUX WITH TRACE AMOUNT OF RESIDUE AND SOLDER PASTE FOR GOLD-TIN ALLOY SOLDER

摘要

PROBLEM TO BE SOLVED: To provide a flux for solder which has excellent soldering property and leaves a small amount of residue after solder-reflow and to provide a gold- tin alloy solder paste using the flux.;SOLUTION: The flux for solder is manufactured by heating an aliphatic saturated dicarboxylic acid which is solid at ordinary temperature, dissolving it into a solvent which is liquid at ordinary temperature, cooling the resultant solution, and adjusting its viscosity to 0.5-100 Pas. The flux is preferably manufactured by dissolving 1-20 wt.% of a 4-10C aliphatic saturated dicarboxylic acid into a trihydric or more alcohol having a viscosity of 50 mPas. The gold-tin alloy solder paste using the flux is also disclosed here.;COPYRIGHT: (C)2004,JPO