DESIGNING METHOD FOR PLATING OF PRINTED CIRCUIT BOARD STRIP AND METHOD FOR FABRICATING SEMICONDUCTOR CHIP PACKAGE USING IT

摘要

PROBLEM TO BE SOLVED: To provide a designing method for plating of a PCB strip in which a failure-free semiconductor chip package can be fabricated by eliminating a short circuit resulting from the misalignment of a solder surface and a component surface at the time of cutting a conventional PCB strip.;SOLUTION: A component surface for mounting a semiconductor chip where copper foil having a circuit pattern formed thereon and conductive via lands, and a bond finger wire-bonded to the copper foil are formed, and a solder surface where the copper foil having the circuit pattern formed thereon and the conductive via lands, and a solder ball part for fusing a solder ball to the copper foil are formed are arranged as one unit. In the designing method for plating of a PCB strip arranged with a plurality of units, either of the solder surface or the component surface is designed to be plated by forming a main plating line between the units.;COPYRIGHT: (C)2003,JPO