SEMICONDUCTOR DEVICE WHICH INCORPORATES MEMORY CHIP AND LOGIC CHIP, AND IN WHICH TEST OF MEMORY CHIP CAN BE PERFORMED

摘要

PROBLEM TO BE SOLVED: To perform effectively an operation test of a memory chip in a semiconductor device of a MCP (memory chip package) in which a logic chip and a memory chip arte mounted in a common package.;SOLUTION: In this semiconductor device incorporating a logic chip having the prescribed functions and a memory chip storing data in a common package, the logic chip and the memory chip are connected through terminals for memory access such as a control signal terminal, an address terminal, a data terminal, the logic chip has a logic circuit having the prescribed function and a memory chip test circuit performing an operation test of the memory chip. In a preferable embodiments, the logic chip has further a selector/output circuit selecting a memory access signal from the logic circuit and an access signal for memory test from the memory chip test circuit and outputting them to the terminal for memory access.;COPYRIGHT: (C)2003,JPO