DIALKENYLDIEPOXYBISPHENOL-POLYSILOXANE ALTERNATE COPOLYMER OR DERIVATIVE OF THE SAME AND EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL OBTAINED BY BLENDING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a dialkenyldiepoxybisphenol-polysiloxane alternate copoly mer which is a novel compound and a derivative of the same, provide a method for producing the same and obtain an epoxy resin composition for electronic materials, especially for sealing semiconductors, improved in lowering stress resistance to heat history without spoiling mechanical strengths, close adhesive ness, adhesivity and heat resistance by blending the novel compound. ;SOLUTION: This dialkenyldiepoxybisphenol-polysiloxane alternate copolymer and the derivative of the same are obtained by a manufacturing method in which a dialkenyldiepoxybisphenol (A) is brought to react with a polysiloxane (B). This epoxy resin composition for electronic materials, especially for sealing semiconductors, is obtained by blending the alternate copolymer.;COPYRIGHT: (C)2003,JPO