首页> 外国专利> BISNADIMIDE-POLYSILOXANE ALTERNATING COPOLYMER OR ITS DERIVATIVE AND EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL CONTAINING THE SAME

BISNADIMIDE-POLYSILOXANE ALTERNATING COPOLYMER OR ITS DERIVATIVE AND EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL CONTAINING THE SAME

机译:含有相同双电子材料的双亚氨基-聚硅氧烷烷氧基化共聚物或其衍生物和环氧树脂组合物

摘要

PROBLEM TO BE SOLVED: To provide a bisnadimide-polysiloxane alternating copolymer which is a novel compound; its derivative; a method for producing the same; and an epoxy resin composition which contains the same, exhibits a lowered stress and an improved resistance to heat hysteresis while retaining its inherent mechanical strengths, adhesive properties, and heat resistance, and is used for electronic materials, especially for semiconductor sealing.;SOLUTION: There are provided a bisnadimide-polysiloxane alternating copolymer produced by the hydrosilylation of (A) an unsaturated-group-containing bisnadimide with (B) a polysiloxane having SiH groups at both molecular ends; a derivative of the copolymer; and an epoxy resin composition for electronic materials, especially for semiconductor sealing, prepared by compounding the alternating copolymer.;COPYRIGHT: (C)2003,JPO
机译:要解决的问题:提供一种新的化合物双萘二酰亚胺-聚硅氧烷交替共聚物。其派生;一种生产方法;含有该环氧树脂组合物的环氧树脂组合物,在保持其固有的机械强度,粘合性能和耐热性的同时,具有降低的应力和改善的耐热滞后性,可用于电子材料,尤其是半导体密封。提供了一种双萘二酰亚胺-聚硅氧烷交替共聚物,该共聚物是通过(A)一种含不饱和基团的双萘酰亚胺与(B)在两个分子末端均具有SiH基团的聚硅氧烷的氢化硅烷化反应制得的。共聚物的衍生物;通过交替共聚物的配混而制备的用于电子材料,特别是用于半导体密封的环氧树脂组合物。; COPYRIGHT:(C)2003,JPO

著录项

  • 公开/公告号JP2003020337A

    专利类型

  • 公开/公告日2003-01-24

    原文格式PDF

  • 申请/专利权人 NIPPON UNICAR CO LTD;

    申请/专利号JP20010206496

  • 发明设计人 SHOJI HIROAKI;MORIKAWA IKUTARO;

    申请日2001-07-06

  • 分类号C08G77/54;C08G59/62;C08L63/00;H01L23/29;H01L23/31;

  • 国家 JP

  • 入库时间 2022-08-22 00:14:57

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