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BISNADIMIDE-POLYSILOXANE ALTERNATING COPOLYMER OR ITS DERIVATIVE AND EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL CONTAINING THE SAME
BISNADIMIDE-POLYSILOXANE ALTERNATING COPOLYMER OR ITS DERIVATIVE AND EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL CONTAINING THE SAME
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机译:含有相同双电子材料的双亚氨基-聚硅氧烷烷氧基化共聚物或其衍生物和环氧树脂组合物
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摘要
PROBLEM TO BE SOLVED: To provide a bisnadimide-polysiloxane alternating copolymer which is a novel compound; its derivative; a method for producing the same; and an epoxy resin composition which contains the same, exhibits a lowered stress and an improved resistance to heat hysteresis while retaining its inherent mechanical strengths, adhesive properties, and heat resistance, and is used for electronic materials, especially for semiconductor sealing.;SOLUTION: There are provided a bisnadimide-polysiloxane alternating copolymer produced by the hydrosilylation of (A) an unsaturated-group-containing bisnadimide with (B) a polysiloxane having SiH groups at both molecular ends; a derivative of the copolymer; and an epoxy resin composition for electronic materials, especially for semiconductor sealing, prepared by compounding the alternating copolymer.;COPYRIGHT: (C)2003,JPO
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