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LAMINATED MATERIAL FOR MANUFACTURING PRINTED WIRING BOARD, LAMINATE, COPPER FOIL WITH RESIN, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD
LAMINATED MATERIAL FOR MANUFACTURING PRINTED WIRING BOARD, LAMINATE, COPPER FOIL WITH RESIN, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD
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机译:用于制造印制线路板,层压板,树脂铜箔,印制线路板和多层印制线路板的层压材料
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摘要
PROBLEM TO BE SOLVED: To provide a laminated material for manufacturing a printed wiring board which can improve high frequency characteristic of the printed wiring board by improving low transmission loss property in the case of high frequency transmission, with a copper foil constituting a conducting layer of the printed wiring board.;SOLUTION: The laminated material for manufacturing a printed wiring board is constituted by laminating resin layers and copper layers. The resin layer is formed of a thermosetting resin composition which contains a component having an unsaturated double bond and in which permittivity of the hardened material becomes at most 3.5. After a copper foil surface on which a resin layer is to be formed is treated by using zinc or a zinc alloy, coupling agent treatment is performed by using a silane coupling agent containing a vinyl group.;COPYRIGHT: (C)2004,JPO
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