首页> 外国专利> PIEZOELECTRIC DEVICE, ITS HOLE SEALING METHOD, HOLE SEALING APPARATUS, PORTABLE TELEPHONE DEVICE UTILIZING THE PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS UTILIZING THE PIEZOELECTRIC DEVICE

PIEZOELECTRIC DEVICE, ITS HOLE SEALING METHOD, HOLE SEALING APPARATUS, PORTABLE TELEPHONE DEVICE UTILIZING THE PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS UTILIZING THE PIEZOELECTRIC DEVICE

机译:压电装置,其孔密封方法,孔密封装置,利用压电装置的便携式电话装置和利用压电装置的电子装置

摘要

PROBLEM TO BE SOLVED: To provide a hole sealing method for piezoelectric device packages which quickly and reliably seals holes of a plurality of or many packages.;SOLUTION: In the method of sealing through-holes formed into a package 36 of a piezoelectric device with a lid 39 fixed to the package 36 tightly supporting a part of a piezoelectric oscillating piece 32, the plurality of packages 36 are arranged with a sealing material 38 laid over the through-holes 37 formed in the packages bottoms, and the sealing material is irradiated with a light beam from a halogen lamp 11 until molten to thereby close the through-holes 37.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种用于压电器件封装的孔密封方法,该方法能够快速可靠地密封多个或多个封装的孔。解决方案:在密封形成于压电器件的封装36中的通孔的方法中,盖39固定在紧紧支撑压电振动片32的一部分的包装36上,在多个包装36中,在形成于包装底部的贯通孔37上覆盖有密封材料38,并照射密封材料。用卤素灯11发出的光束直到熔化以封闭通孔37 .;版权所有:(C)2004,JPO

著录项

  • 公开/公告号JP2003283287A

    专利类型

  • 公开/公告日2003-10-03

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20020084331

  • 申请日2002-03-25

  • 分类号H03H9/02;H01L23/02;H01L41/09;H01L41/22;H03H3/02;

  • 国家 JP

  • 入库时间 2022-08-22 00:16:10

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