BONDING TOOL AND BONDING STAGE, AND HEAD FOR BONDING TOOL AND STAGE PART FOR BONDING STAGE

摘要

PROBLEM TO BE SOLVED: To provide a bonding toll and a boding stage that have an exchangeable head. SOLUTION: The boding toll or bonding stage for mounting semiconductor is composed of the head and a shank part or a pedestal part. The bonding tool is characterized in that a rectangle or circular substrate part to configure the head and a protrusion that protrudes from the substrate part are constructed from one material, the top of the protrusion is coated with vapor-phase synthetic diamond, and the substrate part is mechanically fixed or fixed by vacuum suction to each other.