首页> 外国专利> HEAT CONDUCTIVE COMPOSITE, HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE SHEET AS WELL AS JOINTING STRUCTURE OF HEAT GENERATING BODY AND HEAT DISSIPATION BODY

HEAT CONDUCTIVE COMPOSITE, HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE SHEET AS WELL AS JOINTING STRUCTURE OF HEAT GENERATING BODY AND HEAT DISSIPATION BODY

机译:导热复合材料,导热压敏胶板以及生热体与散热体的连接结构

摘要

PROBLEM TO BE SOLVED: To provide a heat conductive composite having excellent adhesiveness and adhesion properties while having so excellent heat conductivity that thermal convection remarkably deteriorating a heat conductivity, even at a temperature within the operating temperature range of a heat generating body is not generated, a heat conductive heat sensitive adhesive sheet consisting of the heat conductive composite as well as a jointing structure of the heat generating body, and a heat dissipating body which employs a heat conductive heat sensitive adhesive sheet consisting of the heat conductive composite. SOLUTION: In the heat conductive composite consisting of two kinds or more of compounds and used while interposing the same between the heat generating body and the heat dissipating body, the compounds of two kinds or more are under a mixed condition that they will not be spontaneously separated at a temperature lower than that in the operating temperature range of the heat generating body, while the phases of the same are separated into a phase, oozing at a temperature within the operating temperature range of the heat generating body, and another phase, not oozing at the same temperature.
机译:要解决的问题:为了提供一种导热性复合材料,其具有优异的粘合性和粘合性,同时具有非常优异的导热性,以至于即使在发热体的工作温度范围内的温度下也不会产生显着降低热对流的导热性,本发明涉及一种由导热性复合材料构成的导热性热敏粘合片以及发热体的接合结构,以及使用由导热性复合材料构成的导热性热敏粘合性片的散热体。解决方案:在由两种或更多种化合物组成的导热复合材料中,同时将其插入发热体和散热体之间使用时,两种或更多种化合物处于混合状态,不会自发地混合在比发热体的工作温度范围内的温度低的温度下分离的液相,同时将其相分离成在发热体的工作温度范围内的温度下渗出的相和另一相。在相同温度下渗出。

著录项

  • 公开/公告号JP2003152147A

    专利类型

  • 公开/公告日2003-05-23

    原文格式PDF

  • 申请/专利权人 SEKISUI CHEM CO LTD;

    申请/专利号JP20010351619

  • 发明设计人 TOGAWA KATSUYA;AZUMA KENICHI;HYOZU SHUNJI;

    申请日2001-11-16

  • 分类号H01L23/373;B32B7/02;B32B27/00;B32B27/18;C08K3/00;C08L101/00;C09J7/02;C09J11/00;C09J201/00;C09K5/08;H05K7/20;

  • 国家 JP

  • 入库时间 2022-08-22 00:15:35

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