RESIST PATTERN USED FOR BUMP FORMATION BY DEPOSITION LIFT-OFF AND FORMATION METHOD THEREOF, BUMP AND FORMATION METHOD THEREOF AND ELASTIC SURFACE WAVE ELEMENT AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a resist pattern which enables formation of a bump of high adhesion by deposition lift-off.;SOLUTION: A peeling layer 12 which is in contact with an element substrate 2 and can be readily peeled off to the element substrate 2, and a main resist layer 13 which is formed on the peeling layer 12 and has stress resistance higher than the peeling layer 12, are comprised. The peeling layer 12 is constituted of thermoplastic resin such as polydimethylgluterimide, which hardly accelerates polymerization even if it is heated and subjected to light irradiation and has relatively weak resin bonding strength. The main resist layer 13 is constituted of a resin such as acrylic acid ester resin whose polymerization is high and resin bonding strength is high when compared to the thermoplastic resin consisting the peeling layer 12.;COPYRIGHT: (C)2004,JPO