APPLICATION LIQUID FOR FORMING METAL OXIDE FILM, METAL OXIDE FILM USING THE SAME, AND METHOD FOR FORMING METAL OXIDE PATTERN

摘要

PROBLEM TO BE SOLVED: To provide an application liquid for forming metal oxide film which is capable of forming a metal oxide film or a metal oxide pattern which is large in thickness and is free from a crack by the MOD method, and a method for forming the metal oxide film and the metal oxide pattern using the application liquid.;SOLUTION: This application liquid contains a heat-decomposable organic metal A, a solvent B, an organic compound C completing the heat decomposition at a temperature higher than the heat decomposition temperature of the organic metal A and/or an organic compound D which comes to an organic compound Cx completing the heat decomposition at a temperature higher than the heat decomposition temperature of the organic metal A in a film forming process. Further, on the heat decomposition of the organic metal A, the organic compound C and/or the organic compound Cx is allowed to exist and, thereby, the generation of crack is suppressed and prevented.;COPYRIGHT: (C)2003,JPO