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Method for making a silicon carbide resistor with silicon/silicon carbide contacts by induction heating

机译:通过感应加热制造具有硅/碳化硅触点的碳化硅电阻器的方法

摘要

A method for bonding an electrically conductive silicon carbide structure to an electrically conductive siliconized silicon carbide structure by temporarily securing the siliconized silicon carbide structure to the silicon carbide structure; placing the silicon carbide structure with secured siliconized silicon carbide structure into an induction heating furnace having an induction coil which heats electrically conductive material in the furnace when sufficient electrical power at a frequency of from about 300 to about 1000 KC is passed through the coil; and causing sufficient electrical power at a frequency of from about 300 to about 1000 KC to be passed through the coil to raise the temperature of the siliconized silicon carbide structure and silicon carbide structure to a temperature above about 1500° C. at the region of temporary attachment to release the attachment and cause silicon metal to flow from the siliconized silicon carbide structure into the silicon carbide structure to form a siliconized silicon carbide bond between the silicon carbide structure and siliconized silicon carbide structure.
机译:一种通过将碳化硅碳化硅结构临时固定到碳化硅结构上而将导电碳化硅结构键合到导电碳化硅碳化硅结构的方法;将具有固定的碳化硅化碳化硅结构的碳化硅结构放入具有感应线圈的感应加热炉中,当大约300至1000 KC的频率的足够电能通过该线圈时,该感应线圈加热炉中的导电材料;使约300至约1000KC的频率的足够电能通过线圈,以使硅化碳化硅结构和碳化硅结构的温度升高至约1500度以上; C.在临时附着的区域处释放附着并导致硅金属从碳化硅碳化物结构流入碳化硅结构中,从而在碳化硅结构和碳化硅碳化物结构之间形成碳化硅碳化物键。

著录项

  • 公开/公告号US2003131629A1

    专利类型

  • 公开/公告日2003-07-17

    原文格式PDF

  • 申请/专利权人 DUNN MICHAEL P.;TIERNEY BRIAN M.;

    申请/专利号US20020047893

  • 发明设计人 MICHAEL P. DUNN;BRIAN M. TIERNEY;

    申请日2002-01-14

  • 分类号C03B1/00;C03B23/20;C03C27/00;C03C29/00;C03B33/08;C03B23/207;C03C27/02;H05B6/10;

  • 国家 US

  • 入库时间 2022-08-22 00:11:01

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