首页> 外国专利> METHOD AND APPARATUS FOR CONTROLLING CONTAMINATION DURING THE ELECTROPLATING DEPOSITION OF METALS ONTO A SEMICONDUCTOR WAFER SURFACE

METHOD AND APPARATUS FOR CONTROLLING CONTAMINATION DURING THE ELECTROPLATING DEPOSITION OF METALS ONTO A SEMICONDUCTOR WAFER SURFACE

机译：控制在半导体晶片表面上电镀沉积金属过程中的污染的方法和装置

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摘要

A method and apparatus for the electroplating deposition of a metal onto a semiconductor wafer surface (29), including vibrationally scrubbing the wafer surface (29) during an electroplating process. At least one transducer (32) is mounted to a wall (33) of an electroplating tool chamber (22). The transducer (32) intermittently delivers sonic energy pulses lasting for one to two seconds to the electroplating solution during the electroplating process.

机译：一种将金属电镀沉积到半导体晶圆表面（ 29 ）上的方法和设备，包括在电镀过程中振动擦洗晶圆表面（ 29 ）。至少一个换能器（ 32 ）安装到电镀工具腔（ 22 ）的壁（ 33 ）上。换能器（ 32 ）在电镀过程中间歇地将持续一到两秒钟的声波能量传递到电镀液中。 展开▼

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公开/公告号US2003064586A1

专利类型

公开/公告日2003-04-03

原文格式PDF

申请/专利权人 MERCHANT SAILESH MANSINH;OH MINSEOK;RAMAPPA DEEPAK A.;
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申请/专利号US20010965739

发明设计人 DEEPAK A. RAMAPPA;SAILESH MANSINH MERCHANT;MINSEOK OH;
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申请日2001-09-28

分类号C25D1/00;H01L21/76;

国家 US

入库时间 2022-08-22 00:09:01

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