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Multi-layer ferrite chip inductor array and manufacturing method thereof

机译:多层铁氧体芯片电感器阵列及其制造方法

摘要

A multi-layer ferrite chip inductor array, wherein an element main body 11 is composed by laminating a ferrite layer and a conductor layer in such a manner that the laminated face thereof is vertical with an element mounting surface 15, a plurality of coil shaped internal conductors are furnished within the element main body 11, the coiling direction of said coil shaped internal conductor being parallel with the element mounting surface, and the ferrite sheets formed with through-holes are printed with a plurality of coil shaped internal conductors and conductor patterns with the electrically conductive material, and the ferrite sheets are laminated such that the laminated face thereof is vertical with the element mounting surface. This realization of the invention depends on the production method having the process enabling to obtain the laminated body where the plurality of coil shaped internal conductors are formed, the coiling direction of said conductors being parallel with said element mounting surface.
机译:一种多层铁氧体片状电感器阵列,其中,元件主体 11 是通过层叠铁氧体层和导体层以使其层叠面与元件安装面垂直而构成的。 B> 15 ,在元件主体 11 内设有多个线圈状的内部导体,该线圈状的内部导体的卷绕方向与元件安装面平行,并且形成有通孔的铁氧体片被印刷有多个线圈状的内部导体和具有导电性材料的导体图案,并且铁氧体片被层叠为层叠面与元件安装面垂直。本发明的实现取决于具有能够获得形成有多个线圈状内部导体的层叠体的制造方法,其中,所述导体的卷绕方向与所述元件安装面平行。

著录项

  • 公开/公告号US6489875B1

    专利类型

  • 公开/公告日2002-12-03

    原文格式PDF

  • 申请/专利权人 TDK CORPORATION;

    申请/专利号US20000611212

  • 发明设计人 FUMIO UCHIKOBA;TOMOYUKI TATEMORI;

    申请日2000-07-06

  • 分类号H01F50/00;

  • 国家 US

  • 入库时间 2022-08-22 00:04:47

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