首页> 外国专利> Indium source reagent composition, and use thereof for deposition of indium-containing films on subtrates and ion implantation of indium-doped shallow junction microelectronic structures

Indium source reagent composition, and use thereof for deposition of indium-containing films on subtrates and ion implantation of indium-doped shallow junction microelectronic structures

机译:铟源试剂组合物及其在基底上沉积含铟薄膜和离子注入掺杂铟的浅结微电子结构的用途

摘要

An indium precursor composition having utility for incorporation of indium in a microelectronic device structure, e.g., as an indium-containing film on a device substrate by bubbler or liquid delivery MOCVD techniques, or as a dopant species incorporated in a device substrate by ion implantation techniques. The precursor composition includes a precursor of the formula R1R2InL wherein: R1 and R2 may be same or different and are independently selected from C6-C10 aryl, C6-C10 fluoroaryl, C6-C10 perfluoroaryl, C1-C6 alkyl, C1-C6 fluoroalkyl, or C1-C6 perfluoroalkyl; and L is -diketonato or carboxylate. Indium-containing metal films may be formed on a substrate, such as indium-copper metallization, and shallow junction indium ion-implanted structures may be formed in integrated circuitry, using the precursors of the invention.
机译:具有用于将铟掺入微电子器件结构中的铟前体组合物,例如通过鼓泡器或液体输送MOCVD技术作为器件衬底上的含铟膜,或作为通过离子注入技术掺入器件衬底中的掺杂剂。 。前体组合物包括式R 1 R 2 InL的前体,其中:R 1 和R 2 可以相同或不同,并且独立地选自C 6 -C 10 芳基,C 6 -C 10 氟芳基,C 6 -C 10 全氟芳基,C 1 -C 6 烷基,C 1 -C 6 氟代烷基,或C 1 -C 6 全氟代烷基; L为-二酮基或羧酸根。可以使用本发明的前体在基板上形成含铟的金属膜,例如铟铜金属化,并且可以在集成电路中形成注入了浅结铟离子的结构。

著录项

  • 公开/公告号US6602549B1

    专利类型

  • 公开/公告日2003-08-05

    原文格式PDF

  • 申请/专利权人 ADVANCED TECHNOLOGY MATERIALS INC.;

    申请/专利号US20000609516

  • 发明设计人 THOMAS H. BAUM;CHONGYING XU;

    申请日2000-07-03

  • 分类号C23C161/80;

  • 国家 US

  • 入库时间 2022-08-22 00:04:43

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